Thermal Substrates
TO-220,TO-3P,TO-247,TO-3PA Heatsink pad
Description
yellow heatsink pad,gray heatsink pad
TO-220,TO-3P,TO247,TO-3PA series - the thermal conductivity of silicon film characteristics:
- heat transfer coefficient 1.0w/m.k
Thermal conductivity - good and insulation, improve reliability sensitive circuitsand components, prolongs the service life
- chemical corrosion resistance, heat resistance
- insulation, shock absorption, impact resistance
- outdoor use adverse effects can be exempted from ultraviolet light, ozone,water and chemicals
The application scope of TO-220,TO-3P,TO247,TO-3PA series thermal silica:
Each power module
- plane display
- power conversion equipment
- lighting equipment
- screen
Automotive engine control unit.
Each household appliances
Specificaion
Test Item |
Unit |
Data |
Test Method |
Color |
|
Gray,yellow, White,customized make |
Visual |
Thickness |
mm |
0.23-0.5 |
ASTM D374 |
Spec |
mm |
customized make |
ASTM D1204 |
Density |
g/cc |
1.6±0.3 |
ASTM D792 |
Hardness |
Shore C |
40±5 |
ASTM D2240 |
Tensile Strength |
KN/m |
2.3 |
ASTM D412 |
Breakdown Voltage |
Kv/mm |
≥3.0 |
ASTM D149 |
VolumeImpedance |
Ω.cm |
2.1×1016 |
ASTM D257 |
Continuous UsTemp |
℃ |
-40～150 |
EN344
|
Weight Damnify |
% |
≤1 |
@150℃ 240H |
ThermalConductivity |
W/m.k |
1.0 |
|